Sn-3.5Ag Solder
From EVOCD
This data is taken at T=298K
Contents |
MSF Strain-Life Plot
MSF Full Data
Input Data
Output Data
File:Output data Sn-3.5Ag MSF2.txt
References
- ↑ Kariya, Y., & Otsuka, M. (1998). Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys. Journal of Electronic Materials, 27(11), 1229–1235. https://doi.org/10.1007/s11664-998-0074-7
- ↑ Kanchanomai, C., Miyashita, Y., & Mutoh, Y. (2002). Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders. Journal of Electronic Materials, 31(5), 456–465. https://doi.org/10.1007/s11664-002-0100-0
