SAC105 Solder
From EVOCD
Data taken from un-aged samples
Contents |
MSF Strain-Life Plot
MSF Full Data
Input Data
Figure 21 - Fatigue Data (Plastic Strain Range vs. Cycles to Failure) for SAC105 and SAC305 Solders (No Aging)
Output Data
File:Output file SAC105 MSF2.txt
References
- ↑ El-Daly, A. A., Hammad, A. E., Fawzy, A., & A. Nasrallh, D. (2013). Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions. Materials & Design, 43, 40–49. https://doi.org/10.1016/j.matdes.2012.06.058
- ↑ Mustafa, M., Roberts, J. C., Suhling, J. C., & Lall, P. (2014). The effects of aging on the fatigue life of lead free solders. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (pp. 666–683). https://doi.org/10.1109/ECTC.2014.6897357
