View source for Sn-3.5Ag Solder


This data is taken at T=298K

==MSF Strain-Life Plot==
[[File:strain-life_SnAg.png]]

==MSF Full Data==
[[File:full_data_SnAg.png|850px]]

==Input Data==
[[File:Sn-3.5Ag_msf_data.txt]]

[[File:Kariya_input_file.png]]


<ref>Kariya, Y., & Otsuka, M. (1998). Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys. Journal of Electronic Materials, 27(11), 1229–1235. https://doi.org/10.1007/s11664-998-0074-7</ref> 
<ref>Kanchanomai, C., Miyashita, Y., & Mutoh, Y. (2002). Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders. Journal of Electronic Materials, 31(5), 456–465. https://doi.org/10.1007/s11664-002-0100-0
</ref>

==Output Data==
[[File:output_data_Sn-3.5Ag_MSF2.txt]]

==References==
<references/>

[[Category:Metals]]
[[Category:MSF]]
[[Category:Fatigue]]