Miniaturization of electronic component Copper- Copper Oxide
Background and Problem Description
The miniaturization of second-generation electronic devices has paved the word to develop economically and medically. The Miniaturization of electronics chip has contributed to the development of devices that can be positioned in the human body if any organ fails. Integrated Computational Materials Engineering (ICME) helps us to understand and analyze structure, process, performance and the properties. Miniaturization help to combine different interface and investigate the change in strength. ICME transmit information between different length scale depending on the material property and material structure.
Downscaling and Upscaling
In order to understand the method used in mechanical microscale, we have to know how the layers are combined, elastic moduli, and the deformers’ rate. We require information from electronic scale so as to downscale from a microscale to elctronics scal, We start with the first principle of density functionality theory by using VASP cods. Doing this will give the microscale an elastic moduli which is very important for all mechanical microscale models. This will also present data such as E-V curve and generation of stacking faults energy to nanoscale by the use of molecular dynamic codes. There are different software such as MEAM or LAMMPS through which high rate mechanism and adhesion is brought to microscale. The limit of energy of connections between each layers could be passed up to atomistic scale so as to fully understand and know where and how the copper –copper oxide growing can be utilized by phase field modeling on atomistic level.